JPH0428161B2 - - Google Patents

Info

Publication number
JPH0428161B2
JPH0428161B2 JP27831185A JP27831185A JPH0428161B2 JP H0428161 B2 JPH0428161 B2 JP H0428161B2 JP 27831185 A JP27831185 A JP 27831185A JP 27831185 A JP27831185 A JP 27831185A JP H0428161 B2 JPH0428161 B2 JP H0428161B2
Authority
JP
Japan
Prior art keywords
resistor
mic
isolator
metal substrate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27831185A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62136903A (ja
Inventor
Yasuyuki Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP27831185A priority Critical patent/JPS62136903A/ja
Publication of JPS62136903A publication Critical patent/JPS62136903A/ja
Publication of JPH0428161B2 publication Critical patent/JPH0428161B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Reversible Transmitting Devices (AREA)
JP27831185A 1985-12-11 1985-12-11 Ｍｉｃアイソレ−タの無反射終端構造 Granted JPS62136903A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27831185A JPS62136903A (ja) 1985-12-11 1985-12-11 Ｍｉｃアイソレ−タの無反射終端構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27831185A JPS62136903A (ja) 1985-12-11 1985-12-11 Ｍｉｃアイソレ−タの無反射終端構造

Publications (2)

Publication Number Publication Date
JPS62136903A JPS62136903A (ja) 1987-06-19
JPH0428161B2 true JPH0428161B2 (en]) 1992-05-13

Family

ID=17595567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27831185A Granted JPS62136903A (ja) 1985-12-11 1985-12-11 Ｍｉｃアイソレ−タの無反射終端構造

Country Status (1)

Country Link
JP (1) JPS62136903A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638483Y2 (ja) * 1987-06-24 1994-10-05 ソニー株式会社 回転結合器
JPH0182501U (en]) * 1987-11-24 1989-06-01
JPH028205U (en]) * 1988-06-29 1990-01-19
JP2598290Y2 (ja) * 1989-02-10 1999-08-03 富士電気化学 株式会社 非可逆回路装置

Also Published As

Publication number Publication date
JPS62136903A (ja) 1987-06-19

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